Cold fluid semiconductor device release during pick and place operations, and associated systems and methods

ABSTRACT

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/687,015, filed Aug. 25, 2017, which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present technology is directed generally to systems and methods forreleasing semiconductor devices during pick and place operations.

BACKGROUND

Packaged semiconductor dies, including memory chips, microprocessorchips, and imager chips, typically include a semiconductor die, mountedon a substrate and (optionally) encased in a protective covering (e.g.,a molded material, encapsulant, plastic, etc.). The die includesfunctional features, such as memory cells, processor circuits, and/orimager devices, as well as bond pads electrically connected to thesefunctional features. The bond pads can be electrically connected tooutside terminals to allow the die to be connected to other devices(e.g., higher level circuitry).

During a conventional manufacturing process, many semiconductor dies aremanufactured together on a semiconductor wafer, which is then singulatedor diced to form individual dies. Once the dies have been singulated,they are typically handled by “pick and place” machines that remove theindividual dies and place them at processing stations or other locationsfor additional manufacturing steps. As semiconductor devices have becomesmaller and smaller, the ability to handle individual dies withoutbreaking them, particularly during the pick and place process, hasbecome more challenging. Accordingly, there remains a need in the artfor pick and place devices that can handle extremely thin semiconductordies without breaking or otherwise damaging the dies.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partially schematic side view of a semiconductor diehandling system in accordance with an embodiment of the presenttechnology.

FIGS. 2A-2C are partially schematic, enlarged, cross-sectional views ofa portion of the system shown in FIG. 1, including a cooling memberconfigured in accordance with an embodiment of the present technology.

FIG. 3 is a partially schematic, enlarged, cross-sectional view of aportion of the system shown in FIG. 1, including a cooling memberconfigured in accordance with another embodiment of the presenttechnology.

FIG. 4 is a partially schematic, enlarged, cross-sectional view of aportion of the system shown in FIG. 1, including a cooling memberconfigured in accordance with another embodiment of the presenttechnology.

FIG. 5 is a flow diagram of a process or method for handling asemiconductor device in accordance with an embodiment of the presenttechnology.

DETAILED DESCRIPTION

Specific details of several embodiments of semiconductor device handlingsystems for releasing semiconductor devices (e.g., semiconductor dies)from a dicing tape, or other support substrate, are described below. Inseveral of the embodiments described below, a semiconductor handlingsystem includes a cooling member configured to cool the supportsubstrate to loosen or release the bond(s) holding a semiconductor dieto the support substrate, before the semiconductor die is removed fromthe support substrate. For example, some embodiments include directing agaseous or liquid cold fluid toward a die attach region of the supportsubstrate proximate to where the semiconductor die is attached to thesubstrate, to loosen a bond between the semiconductor die and anunderlying layer of dicing tape. When a pick and place system lifts thedie from the dicing tape, the die is less likely to break due to thepreceding process of loosening the bond. Accordingly, the yield ofintact dies or other semiconductor devices handled by systems configuredin accordance with the present technology is expected to be greater thanfor conventional systems.

As used herein, the terms “vertical,” “lateral,” “upper,” and “lower”can refer to relative directions or positions of features in thesemiconductor die assemblies in view of the orientation shown in theFigures. For example, “upper” or “uppermost” can refer to a featurepositioned closer to the top of a page than another feature. Theseterms, however, should be construed broadly to include semiconductordevices having other orientations, such as inverted or inclinedorientations where top/bottom, over/under, above/below, up/down, andleft/right can be interchanged depending on the orientation.

FIG. 1 is a partially schematic side view of a semiconductor devicehandling system 100 (“system 100”) configured to “pick and place”semiconductor devices in accordance with embodiments of the presenttechnology. The system 100 includes a support member 110 that carries asupport substrate 120 having a lower surface 125 a and an upper surface125 b. A semiconductor device 150 is releasably attached to the uppersurface 125 b of the support substrate 120 and includes a plurality ofsemiconductor dies 152. A picking device 130 is positionable above thesupport substrate 120 at a pick station 111 for removing (e.g.,“picking”) individual semiconductor dies 152 from the support substrate120 at the pick station 111. An ejector device 140 is positionable belowthe support substrate 120 at the pick station 111 for facilitating thepicking process. The system 100 further includes a cooling member 160configured to direct a release fluid (e.g., a cold fluid) toward thesupport substrate 120 and/or semiconductor device 150 at the pickstation 111 to aid in loosening, releasing, or at least partiallyreleasing the semiconductor dies 152 from the support substrate 120prior to the picking device 130 removing the semiconductor dies 152.This is expected to reduce damage to the semiconductor dies 152 from thepick and place process as compared to conventional pick and placessystems.

In a particular embodiment, the support substrate 120 includes a dicingframe 122 that carries a sheet of dicing tape 124 having the lowersurface 125 a and upper surface 125 b. The semiconductor device 150 isreleasably attached to the upper surface 125 b of the dicing tape 124.As illustrated in FIG. 1, the dicing frame 122 can have an annular shapesuch that all or a portion of the semiconductor device 150 is over onlythe dicing tape 124. Therefore, the lower surface 125 a of the dicingtape 124 can be exposed below the semiconductor device 150. The dicingtape 124 can include a UV-cured, cross-linked material that engages withthe semiconductor device via electrostatic forces, mechanical forces (byconforming to topographical features on the backside of thesemiconductor device 150), and/or other forces. In some embodiments, thesemiconductor device 150 is a semiconductor wafer that has been diced orsingulated to form the individual semiconductor dies 152 before thepicking device 130 performs a pick and place operation.

The picking device 130 can include a pick head 132 having a pick tip 134which contacts the semiconductor dies 152 prior to removal. The pickhead 132 can be coupled to a vacuum source 170, which allows the picktip 134 to releasably engage with individual semiconductor dies 152 viaa suction or vacuum force. Prior to lifting an individual semiconductordie 152 away from the support substrate 120, the ejector device 140 canpush the individual semiconductor die 152 upwardly relative to itsneighbors, to facilitate removing just one die 152 at a time.

The system 100 can further include components for selectively holdingthe support substrate 120 and/or the semiconductor device 150 inposition. For example, in some embodiments, the ejector device 140 canbe coupled to the vacuum source 170 such that the ejector device 140 canreleasably engage the lower surface 125 a of the dicing tape 124 belowan individual semiconductor die 152. Accordingly, in some embodiments,the ejector device 140 can pull the individual semiconductor die 152toward the ejector device 140 prior to the ejector device 140 pushingthe semiconductor die 152 upward, to further facilitate removing justone semiconductor die 152 at a time. In some embodiments, the vacuumsource 170 can be further coupled to the support member 110 to hold thesupport substrate 120 (e.g., the dicing frame 122) in position relativeto the support member 110. In other embodiments, the system 100 caninclude multiple vacuum sources, for example, one to hold the supportsubstrate 120 in position, another to releasably engage the lowersurface 125 a of the dicing tape 124, and/or another to hold thesemiconductor die 152 in contact with the pick tip 134. In otherembodiments, the support substrate 120 can be fastened or fixed to thesupport member by other mechanical mechanisms. For example, the dicingframe 122 can be secured to the support member 110 via clips, fasteners,adhesives, etc.

In order to remove each of the semiconductor dies 152 one at a time, thesystem 100 is configured to provide for relative movement between thesupport member 110, and the pick head 132 and ejector device 140. Thatis, the position of the support member 110 relative to the pick head 132and ejector device 140 is variable so that each semiconductor die 152may be positioned at the pick station 111 for removal. Accordingly, insome embodiments, the support member 110 can be actuated to translaterelative to one or more axes (e.g., along one or more the axes indicatedby reference numerals X, Y and Z). In addition to or in lieu of thesupport member 110 moving, the picking device 130 can move via a guide136 or other suitable device. Accordingly, the pick tip 134 cantranslate along one or more axes (e.g., along the three axes X, Y andZ). Similarly, in some embodiments, the ejector device 140 can beconfigured to move relative to the support member 110 via a separateguide or device (not pictured) such that it can be positioned below thepick tip 134 at the pick station 111. In certain embodiments, theejector device 140 is configured to translate along only a single axis(e.g., along the axis Z). In some such embodiments, the ejector device140 is moved away from the support substrate 120 along the axis Z afteran individual semiconductor die 152 is removed, and moved toward thesupport substrate 120 to contact the support substrate 120 before asubsequent semiconductor 152 (e.g., a neighboring semiconductor die 152)is removed. Once semiconductor dies 152 are removed by the pickingdevice 130, the removed semiconductor dies can be placed at anotherlocation within the overall system 100, or can be transferred outsidethe system 100.

The system 100 can further include a cold fluid source 180 that suppliesa cold fluid to the cooling member 160 for facilitating the release ofindividual semiconductor dies 152 from the support substrate 120.Further details of the cooling member 160 and release operation aredescribed later with reference to FIGS. 2A-4.

In some embodiments, the system 100 includes a controller 190 programmedwith instructions for directing the operations and motions carried outby the support member 110, the picking device 130, the ejector device140, the cooling member 160, and/or other components of the system 100.Accordingly, the controller 190 can include a processor, memory,input/output devices, and a computer-readable medium containinginstructions for performing some or all of the tasks described herein.

FIGS. 2A-2C are enlarged, partially schematic, cross-sectional views ofa portion of the system 100 shown in FIG. 1 at different stages in apick and place operation for removing a semiconductor die. FIG. 2Aillustrates multiple semiconductor dies 152 attached to the uppersurface 125 b of the dicing tape 124, including a first semiconductordie 152 a (in position at the pick station 111) and two neighboringsecond semiconductor dies 152 b. More specifically, the dicing tape 124can include a plurality of die attach regions below and/or proximate toindividual ones of the semiconductor dies 152, and each individualsemiconductor die 152 can be attached to the dicing tape 124 at acorresponding die attach region of the dicing tape 124. For example, thefirst semiconductor die 152 a can be attached to the dicing tape 124 ata first die attach region 226 a, and the second semiconductor dies 152 bcan be attached to the dicing tape 124 at second die attach regions 226b. As illustrated in FIG. 2A, the pick tip 134 of the pick head 132 hasyet to engage the first semiconductor die 152 a at the pick station 111.

The pick tip 134 can include multiple vacuum ports 235 coupled to avacuum source (e.g., the vacuum source 170 of FIG. 1) via a vacuum flowpath 237. The vacuum ports 235 can be individual passages (as shown inFIGS. 2A-2C), or can have other configurations. For example, the picktip 134 can include or be formed from a foam that is porous so as toallow vacuum forces to act on the first semiconductor die 152 a. Thevacuum flow path 237 can include a plenum 238 in fluid communicationwith one or more of the vacuum ports 235, and a conduit or otherpassageway 239 that extends from the vacuum ports 235 to a suitablepoint for a connection to the vacuum source 170. When the vacuum source170 is activated, the first semiconductor die 152 a is releasablysecured in contact with the pick tip 134 of the pick head 132 via thevacuum ports 235.

The ejector device 140 includes an upper portion or dome 242 positionedat the pick station 111. The first semiconductor die 152 a and thecorresponding first die attach region 226 a of the dicing tape 124 arepositioned over the dome 242 at the pick station 111. In the embodimentillustrated in FIGS. 2A-2C, the dome 242 includes an internal chamber241 and one or more ejector pins 244 at least partially within thechamber 241. The dome 242 further includes a plurality of apertures 246extending through an upper surface of the dome 242 and aligned with theejector pins 244. The ejector pins 244 are configured to be actuated viaone or more actuators 248 to extend upwardly through correspondingapertures 246 in the dome 242 to contact the lower surface 125 a of thedicing tape 124 at the first die attach region 226 a. As shown in FIG.2A, the ejector pins 244 are in a non-actuated position within theejector device 140 and the first semiconductor die 152 a is positionedgenerally coplanar with the neighboring second semiconductor dies 152 b.The ejector device 140 can further include at least one vacuum port 243fluidly coupled to a vacuum source (e.g., the vacuum source 170 ofFIG. 1) and providing a fluid pathway between the vacuum source and thechamber 241 of the ejector device 140. When the vacuum source isactivated, the lower surface 125 a of the dicing tape 124 at the firstdie attach region 226 a is releasably secured in contact with the dome242 via a suction or vacuum force exerted through the apertures 246and/or additional apertures (not pictured) in the dome 242. In someembodiments, the suction or vacuum force can pull the firstsemiconductor die 152 a downwards such that is lowered relative to theneighboring second semiconductor dies 152 b.

The cooling member 160 can include a cooling structure 262 positioned atthe pick station 111 and configured (e.g., shaped and positioned) todirect a cold fluid 268 toward the dicing tape 124 at the first dieattach region 226 a to cool the dicing tape 124 at the first die attachregion 226 a. The cooling structure 262 defines a cavity 266 (e.g., achamber) and can surround at least a portion of the ejector device 140.More particularly, the cooling structure 262 can have a generallyannular shape and can be attached to an exterior surface of the dome 242of the ejector device 140. For example, the cooling structure 262 can bea ring having a circular, oval, polygonal, or other shape that matchesthe exterior shape of the ejector device 140 such that the coolingstructure 262 can be snugly installed onto the ejector device 140. Insome embodiments, the cooling structure 262 can be removably attached orpermanently affixed to the ejector device 140. In this manner thecooling member 160 can be configured for installation into existing pickand place systems, for example, having conventional or previouslymanufactured ejector devices. In other embodiments, the coolingstructure 262 can be integrally formed with the ejector device 140.

The cavity 266 is configured to receive the cold fluid 268 from a coldfluid source (e.g., the cold fluid source 180 of FIG. 1). In someembodiments, a port 264 in the cooling structure 262 fluidly connectsthe cavity 266 to the cold fluid source 180 which supplies the coldfluid 268. The cooling structure 262 can alternatively or additionallybe fluidly coupled to the cold fluid source 180 via one or more pipes,conduits, or other fluid passageways that are not pictured in FIGS.2A-2C. At least a portion of the cavity 266 is positioned adjacent to atleast a portion of the first die attach region 226 a so that the coldfluid 268 can cool the dicing tape 124. For example, in the illustratedembodiment, the cavity 266 is positioned adjacent to an outer portion(e.g., an outer annular portion) of the first die attach region 226 a ofthe dicing tape 124, since the cooling structure 262 is positionedaround the ejector device 140. Depending on the relative sizes of thecooling structure 262 and the ejector device 140, the cavity 266 can bepositioned adjacent to more or less of the first die attach region 226a. The cold fluid 268 at least partially fills the cavity 266 when thecold fluid source 180 is activated, which allows the cold fluid 268 tocool the portion of the first die attach region 226 a of the dicing tape124 that is adjacent to the cavity 266 via heat transfer away from thedicing tape 124. That is, the cooling structure 262 directs the coldfluid 268 toward a portion of the lower surface 125 a of the dicing tape124 at the first die attach region 226 a to cool (e.g., freeze) the dieattach region 226 a of the dicing tape 124.

In some embodiments, the cooling structure 262 is a closed structuresuch that cavity 266 is a sealed chamber. In such embodiments, the coldfluid 268 does not directly contact the dicing tape 124 when the coldfluid source 180 is activated. Rather, the cold fluid 268 indirectlycools the dicing tape 124 at the first die attach region 226 a bycooling the cooling structure 262 which is in contact with and/orproximate to the dicing tape 124. In other embodiments, the coolingstructure 262 is not a closed structure such that the cold fluid 268 candirectly flow against and contact the lower surface 125 a of dicing tape124 when the cold fluid source 180 is activated. For example, in someembodiments, the lower surface 125 a of the dicing tape 124 ispositioned directly above the cavity 266 when the lower surface 125 a isreleasably secured in contact with the dome 242 via the suction orvacuum force exerted through the apertures 246. The dicing tape 124 cantherefore enclose the cavity 266 to provide a sealed or partially sealedregion in which the cold fluid 268 can contact and cool the dicing tape124.

The cold fluid 268 supplied by the cold fluid source 180 can be anysuitable fluid (e.g., air, nitrogen, etc.) and can be in a liquid and/orgaseous state. In some embodiments, the cold fluid source 180 is a coldair cannon configured to flow cold air into the cooling structure 262through the port 264 and/or other fluid passageways (not pictured). Incertain embodiments the cold air from the cold air cannon has atemperature of about −12° Celsius or lower than about −12° Celsius. Inother embodiments, the cold fluid 268 is liquid nitrogen.

Cooling the dicing tape 124 at the first die attach region 226 afacilitates the release of the first semiconductor die 152 a from thedicing tape 124 by, for example, loosening the attachment forces betweenthe first semiconductor die 152 a and the dicing tape 124, and/orotherwise weakening the bond(s) (e.g., electrostatic, mechanical and/orother bonds) between these two components. Thus, the pick head 132 canmore easily lift the first semiconductor die 152 a away from the dicingtape 124 without breaking the first semiconductor die 152 a (FIG. 2C).In some embodiments, lowering the temperature of the dicing tape 124causes the dicing tape 124 to freeze, reduces the tackiness of thedicing tape 124, shrinks the dicing tape 124, reduces the adhesivenessof the dicing tape 124, and/or makes the dicing tape 124 more brittle.The temperature reduction of the dicing tape 124 and the resultingphysical changes can depend on the type and quantity of the cold fluid268, the properties of the dicing tape 124, the length of time thedicing tape 124 is exposed to the cold fluid 268, etc. In someembodiments, the cooling member 160 can sufficiently loosen the bondsbetween the dicing tape 124 and the first semiconductor die 152 a afterthe first semiconductor die 152 a has been at the pick station 111 foronly a few seconds. However, this time may vary in embodiments where thefactors listed above differ.

FIG. 2B illustrates the system 100 after the pick tip 134 of the pickhead 132 has engaged the first semiconductor die 152 a, and after theejector pins 244 have been actuated upwardly by the one or moreactuators 248 to contact the lower surface 125 a of the dicing tape 124at the first die attach region 226 a. When the ejector pins 244 areextended upwardly, the first semiconductor die 152 a is raised relativeto the neighboring second semiconductor dies 152 b. This arrangement canmake it easier for the pick head 132 to retrieve one semiconductor dieat a time. Moreover, in some embodiments, because the cooling member 160cools the dicing tape 124 at the first die attach region 226 a prior toactuation of the ejector pins 244, the ejector pins 244 can helpfacilitate the release of the first semiconductor die 152 a. Forexample, the contact force of the ejector pins 244 against the cooleddicing tape 124 can loosen or break the bond(s) between the dicing tape124 and the first semiconductor die 152 a and cause at least a portionof the dicing tape 124 at the first die attach region 226 a to peel awayfrom or otherwise release from the first semiconductor die 152 a. Insome embodiments, the ejector pins 244 are first actuated while thelower surface 125 a of the dicing tape 124 is releasably secured incontact with the dome 242 of the ejector device 140 via a suction orvacuum force, as described above. This combination of a downward suctionforce and upward force resulting from the ejector pins 244 can furthercause the cooled dicing tape 124 to release from the first semiconductordie 152 a.

As further illustrated in FIG. 2B, in some embodiments the cold fluid268 (FIG. 2A) no longer fills the cavity 266 of the cooling structure262 after the ejector pins 244 are actuated upward and/or after the pickhead 132 engages the first semiconductor die 152 a. For example, incertain embodiments, the cold fluid 268 (e.g., that is warmed by theinduced heat transfer from the dicing tape 124) is vented or exhaustedthrough the port 264 and/or other portions of the cooling member 160. Inembodiments where the cooling structure 262 is not a sealed or closedstructure, the cold fluid 268 is free to flow from the cavity 266 andout of the cooling structure 262. In yet other embodiments, the coolingmember 160 can be a closed system in which the cold fluid 268 isreturned from the cooling structure 262 to the cold fluid source 180(e.g., via a second port in the cooling structure 262).

FIG. 2C illustrates the system 100 after the first semiconductor die 152a has been fully released from the dicing tape 124, and duringtranslation of the support substrate 120 (e.g., the dicing tape 124 anddicing frame 122) in the direction of arrow A. The first semiconductordie 152 a is secured in contact with the pick tip 134 of the pick head132 via the vacuum ports 235. As described above, the pick head 132 canbe movable relative to the support substrate 120 and/or ejector device140 such that the first semiconductor die 152 a can be moved away fromthe pick station 111 and to a release station (not pictured; e.g., at astation configured for further processing). Similarly, the supportsubstrate 120 can be movable such that another semiconductor die 152(e.g., the leftmost neighboring second semiconductor die 152 b) can bepositioned at the pick station 111, as shown in FIG. 1. Moreover, theejector device 140 can be movable in at least one direction relative tothe support substrate 120 to, for example, permit movement of thesupport substrate 120 without interference from the ejector device 140.For example, in the embodiment shown in FIG. 2C, the ejector device 140has been moved downwards relative to the support substrate 120 in thedirection of arrow B to permit free movement of the support substrate120. When the neighboring second semiconductor die 152 b is in positionat the pick station 111, the ejector device 140 can be moved upwards tocontact the dicing tape 124 as shown in FIG. 2A. Moreover, as shown inFIG. 2C, the actuators 248 can retract (e.g., actuate downwardly) theejector pins 244 prior to positioning of the second semiconductor die152 b at the pick station 111.

The cooling member 160 can at least partially refill the cavity 266 ofthe cooling structure 262 with the cold fluid 268 while the pick head132 moves the first semiconductor die 152 a to the release stationand/or while the neighboring second semiconductor die 152 b is moved tothe pick station 111. The cooling member 160 can therefore cool the dieattach region 226 b beneath the neighboring second semiconductor die 152b as soon as the die attach region 226 b is positioned at the pickstation 111. In other embodiments, the cooling member 160 can beconfigured to supply the cold fluid 268 to the cooling structure 262only after the support substrate 120 is repositioned.

FIG. 3 is an enlarged, partially schematic, cross-sectional viewillustrating a portion of the system 100 shown in FIG. 1 having acooling member 360 configured in accordance with another embodiment ofthe present technology. The cooling member 360 may be provided in lieuof or in addition to the cooling member 160 of FIGS. 2A-2C. The coolingmember 360 is integrated with the ejector device 140 and includes atleast one port 364 that fluidly connects the chamber 241 of the ejectordevice 140 to a cold fluid source (e.g., the cold fluid source 180 ofFIG. 1). In some embodiments, the cold fluid source 180 is fluidlycoupled to the port 364 via one or more pipes, conduits, or other fluidpassageways that are not pictured in FIG. 3. Accordingly, the cold fluid268 supplied by the cold fluid source 180 can at least partially fillthe chamber 241 when the cold fluid source 180 is activated. One or morecooling apertures 346 in the dome 242 of the ejector device 140, and/orthe apertures 246 (corresponding to the ejector pins 244), can directthe cold fluid 268 toward a portion of the lower surface 125 a of thedicing tape 124 at the first die attach region 226 a to the cool thefirst die attach region 226 a. In some embodiments, the cold fluidsource 180 can be activated after or before a vacuum source (e.g., thevacuum source 170) fluidly coupled to the chamber 241 such that the coldfluid 268 is not removed from the chamber 241 as a result of the vacuumpressure within the chamber 241. In other embodiments, the ejectordevice 140 can include at least two internal chambers—one fluidlycoupled to a vacuum source and another fluidly coupled to a cold fluidsource—each having corresponding apertures in the dome 242 to permitinteraction with the dicing tape 124.

In some embodiments, the cooling member 360 allows for a more evencooling of the first die attach region 226 a of the dicing tape 124 thanthe cooling member 160 illustrated in FIGS. 2A-2C. In particular,directing the cold fluid 268 toward the lower surface 125 a of thedicing tape 124 through the cooling apertures 346 allows the cold fluid268 to contact an interior portion (e.g., nearer the center of the firstsemiconductor die 152 a) of the first die attach region 226 a. Such aninterior portion may not be directly above the cavity 266 of the coolingmember 160, and therefore not directly cooled by the cooling member 160.However, it may be more difficult to modify existing pick and placesystems to include the cooling member 360 as compared to the coolingmember 160. For example, as described above, in some embodiments thecooling member 160 can be integrated into existing pick and placesystems either without modification or with relatively minormodifications.

Each of the embodiments illustrated in FIGS. 2A-3 share the advantagethat they direct a cold fluid towards a lower surface of 125 a of thedicing tape 124—rather than the upper surface 125 b to which thesemiconductor dies 152 are attached. Thus, the cold fluid 268 does notdirectly contact the semiconductor dies 152 which could potentiallydamage or contaminate the dies. However, some embodiments of the presenttechnology include a cooling member configured to direct a cold fluidtoward the upper surface 125 b of the dicing tape 124 at the first dieattach region 226 a and/or toward the first semiconductor die 152 a.

For example, FIG. 4 is an enlarged, partially schematic, cross-sectionalview illustrating a portion of the system 100 shown in FIG. 1 having acooling member 460 configured in accordance with another embodiment ofthe present technology. The cooling member 460 may be provided in lieuof or in addition to the cooling member 160 of FIGS. 2A-2C and/or thecooling member 360 of FIG. 3. The cooling member 460 can have somefeatures generally similar to those of the cooling member 160. Forexample, the cooling member 460 can include a cooling structure 462positioned at the pick station 111 and defining a cavity 466 (e.g., achamber), and can be configured to cool the die attach region 226 a ofthe dicing tape 124. In contrast to the cooling member 160, the coolingmember 460 is positioned above the support substrate 120 (e.g., abovethe dicing tape 124). For example, in the embodiment illustrated in FIG.4, the cooling member 460 surrounds at least a portion of the pick head132 of the picking device 130 and is configured to direct a cold fluid(e.g., the cold fluid 268) toward the first semiconductor die 152 aand/or the upper surface 125 b of the dicing tape 124. Moreparticularly, the cooling structure 462 can have an annular shape andcan be permanently or releasably attached to an exterior surface of thepick tip 134 of the pick head 132. In other embodiments, the coolingmember 460 can be coupled to the picking device 130 differently orotherwise positioned differently above the support substrate 120 fordirecting the cold fluid toward the first die attach region 226 a of thedicing tape 124 (e.g., toward the first semiconductor die 152 a). Thecooling member 460 can further include a port 464 fluidly coupled to acold fluid source (e.g., the cold fluid source 180), which supplies thecavity 466 of the cooling member 460 with the cold fluid 268.

In the embodiment illustrated in FIG. 4, the pick tip 134 is releasablyengaged to the first semiconductor die 152 a at the pick station 111,and the ejector pins 244 have yet to be actuated upwardly by theactuators 248. The cavity 466 of the cooling member 460 is positionedadjacent to at least a portion of the first semiconductor die 152 aand/or the upper surface 125 b of the dicing tape 124. For example, inthe illustrated embodiment, the cavity 466 is positioned adjacent to anouter portion (e.g., an outer annular portion) of the firstsemiconductor die 152 a and above an outer annular portion of the firstdie attach region 226 a dicing tape 124 (e.g., the exposed region ofdicing tape 124 between the first semiconductor die 152 a and theneighboring second semiconductor dies 152 b). The cold fluid 268 atleast partially fills the cavity 266 when the cold fluid source 180 isactivated, which allows the cold fluid 268 to cool the firstsemiconductor die 152 a and/or the exposed portion of the dicing tape124. Cooling the first semiconductor die 152 a indirectly cools thefirst die attach region 226 a of the dicing tape 124 to facilitate therelease of the first semiconductor die 152 a.

One feature of at least some of the systems and methods described abovewith reference to FIGS. 1-4 is that a cold fluid is used to at leastweaken (e.g., weaken or break) the bonds between a semiconductor die orother semiconductor device, and an underlying dicing tape or othersupport substrate. By at least reducing these forces, the likelihood forthe picking device to consistently remove the semiconductor dies withoutbreaking or otherwise damaging them can be significantly improved. Thisis particularly advantageous in situations where the semiconductor diesare extremely thin (e.g., 100 microns thick, or thinner). Accordingly,the yield for such thin dies can be significantly improved. Thisarrangement can provide advantages in a production environment, in whichhigh yield has a clear production benefit, and/or a researchenvironment, in which the number of available dies for testing may belimited, and each broken or damaged die can significantly impedeadvances in the associated research.

FIG. 5 is a flow diagram of a process or method 500 for handlingsemiconductor devices in accordance with an embodiment of the presenttechnology. The process 500 can be carried out, for example, using oneor more of the handling systems described above with reference to FIGS.1-4. Beginning at block 502, the process 500 comprises cooling a supportsubstrate to loosen a bond between the support substrate and asemiconductor device (e.g., a singulated semiconductor die) releasablyattached to the support substrate. For example, the support substratecan include a dicing tape with the semiconductor device releasablyattached thereto, and cooling the support substrate can includedirecting a cold fluid toward the dicing tape proximate to where thesemiconductor device is releasably attached to the dicing tape. At block504, the process includes engaging a picking device with thesemiconductor device. At block 506, the process includes removing thesemiconductor device from the support substrate (e.g., from a dicingtape) with the picking device. In some embodiments, cooling the supportsubstrate (block 502) before removing the semiconductor device with thepicking device (block 506) reduces the likelihood that the semiconductordevice will be damaged during removal from the support substrate. Incertain embodiments, the picking device engages the semiconductor device(block 504) before the support substrate is cooled (block 502).

From the foregoing, it will be appreciated that specific embodiments ofthe present technology have been described herein for purposes ofillustration, but that various modifications may be made withoutdeviating from the scope of the present technology. For example, inparticular embodiments, the details of the picking device and/or thecooling member may be different than those shown in the foregoingFigures. In some embodiments, the various embodiments may be combinedto, for example, to incorporate more than one cooling member. Inparticular embodiments, the cold fluids used to release individual diesfrom the associated dicing tape, or other supporting component, may bedifferent or have different compositions than those expressly disclosedherein. The cold fluid can be delivered from a cooling member installedon or integrated with an ejector device, or from any cooling memberconfigured to deliver or direct the cold fluid toward the dicing tape orother supporting component. Accordingly, the cooling member can bepositioned above or below the support substrate. The support substratecan be configured to support the semiconductor device via a dicing tape,as described in connection with several embodiments above, or via otherreleasable media or mechanisms. In particular embodiments (e.g., whenthe support substrate includes a dicing tape), the forces released bythe cold fluid are primarily electrostatic and/or mechanical forces, andin other embodiments, the forces may be of different types, in additionto or in lieu of electrostatic and/or mechanical forces. In any of theseembodiments, the forces may vary depending on factors that include thetype and/or age of the support substrate, the roughness of the waferbackside, the presence or absence of residual seed layer material, thenature of the process most recently completed on the wafer, and/or otherfactors. The pick and place operation can be performed immediately afterdicing, or in association with other processes, e.g., thermocompressionbonding, die sorting, and/or flip chip tool operations. The pick andplace operation performed by the systems described herein, including theoperation of the cooling member, can be controlled (e.g., by anautomated controller). The system may be used just prior to a diepackaging operation, and/or at any suitable step in the fabricationprocess for which the pick and place operation is used.

Certain aspects of the technology described in the context of particularembodiments may be combined or eliminated in other embodiments. Further,while advantages associated with certain embodiments have been describedin the context of those embodiments, other embodiments may also exhibitsuch advantages and not all embodiments need necessarily exhibit suchadvantages to fall within the scope of the present technology.Accordingly, the present disclosure and associated technology canencompass other embodiments not expressly shown or described herein.

I/We claim:
 1. A system for handling semiconductor dies, comprising: a support member positioned to carry at least one semiconductor die releasably attached to a die attach region of a support substrate; a picking device having a vacuum pick head and positioned to pick the semiconductor die at a pick station; and a cooling member configured to direct a cold fluid toward the die attach region at the pick station.
 2. The system of claim 1 wherein the support substrate includes a frame carrying a dicing tape.
 3. The system of claim 1 wherein the semiconductor die is releasably attached to an upper surface of a dicing tape at the die attach region, and wherein the cooling member directs the cold fluid toward a lower surface of the dicing tape opposite the upper surface.
 4. The system of claim 1 wherein the cold fluid loosens a bond between the semiconductor die and the support substrate.
 5. The system of claim 1, further comprising an ejector device at the pick station, wherein the support substrate is positioned between the pick head and the ejector device, and wherein the ejector device includes one or more ejector pins coupled to an actuator and configured to move upwardly to contact a lower surface of the support substrate.
 6. The system of claim 5 wherein the cooling member includes a cold fluid structure having an annular shape and positioned around the ejector device, wherein the cold fluid structure defines an opening below the support substrate, and wherein the cold fluid is directed toward the die attach region via the opening.
 7. The system of claim 1 further comprising an ejector device at the pick station, wherein the support substrate is positioned between the pick head and the ejector device, wherein the cooling member is fluidly coupled to the ejector device, wherein the ejector device includes at least one aperture positioned proximate the support substrate, and wherein the cold fluid is directed toward the die attach region via the aperture.
 8. The system of claim 1 wherein the cooling member is coupled to the picking device.
 9. The system of claim 1 wherein the cold fluid is a gas having a temperature of about or less than about −12 degrees Celsius.
 10. The system of claim 1 wherein the cold fluid is a liquid that contacts the support substrate.
 11. A method for handling semiconductor dies, comprising: cooling a support substrate to loosen a bond between the support substrate and a singulated semiconductor die releasably attached to the support substrate; engaging a picking device with the singulated semiconductor die; and removing the singulated semiconductor die from the support substrate with the picking device.
 12. The method of claim 11 wherein the support substrate includes a dicing frame and a dicing tape, wherein the singulated semiconductor die is attached to the dicing tape at a die attach region of the dicing tape, and wherein cooling the support substrate includes directing a cold fluid toward the die attach region.
 13. The method of claim 11 wherein engaging the picking device with the singulated semiconductor die is performed before cooling the support substrate.
 14. The method of claim 11 wherein engaging the picking device with the singulated semiconductor die is performed after cooling the support substrate.
 15. The method of claim 11, further comprising: releasably attaching at least a portion of a semiconductor wafer to the support substrate; and singulating semiconductor dies of the semiconductor wafer while the semiconductor wafer is attached to the support substrate.
 16. The method of claim 11 wherein the singulated semiconductor die is releasably attached to an upper surface of the support substrate, and wherein the method further comprises: actuating an ejector device such that an ejector pin of the ejector device moves upwardly through an aperture of the ejector device to contact a lower surface of the support substrate, wherein cooling the support substrate includes directing a cold fluid toward the support substrate via the aperture.
 17. A system for handling semiconductor dies, comprising: a support member positioned to carry a semiconductor wafer, the semiconductor wafer having a plurality of semiconductor dies releasably attached to a dicing tape carried by a dicing frame; a picking device having a vacuum pick head, the pick head positioned above the semiconductor wafer and configured to pick individual ones of the semiconductor dies at a pick station; an ejector device positioned below the semiconductor wafer at the pick station and having at least one ejector pin configured to move upwardly to contact the dicing tape; and a cooling member coupled to a cold fluid source and configured to cool the dicing tape at the pick station.
 18. The system of claim 17 wherein the cooling member includes a cooling structure at least partially around the ejector device, and wherein a cold fluid from the cold fluid source is injected into the cooling structure to cool the dicing tape.
 19. The system of claim 17 wherein the support member is configured to move the semiconductor wafer relative to the picking device and the ejector device to position an individual semiconductor die at the pick station.
 20. The system of claim 17 wherein upward movement of the at least one ejector pin elevates an individual singulated semiconductor die at the pick station relative to neighboring dies. 